The technology giant Huawei has unveiled its plans for the next generations of the Ascend chip series during the Huawei Connect 2025 event held in Shanghai this week. The company plans to produce three new series of Ascend chips: 950, 960, and 970.
Notably, the company has decided to release several large sets of its software as open source, including AI models from the openPangu initiative and a suite of SDKs from the Mind series.
The Ascend 970 series, scheduled for release in the fourth quarter of 2028, is expected to provide a bandwidth of 4 terabits per second and achieve 8 PFLOPs of FP4, accompanied by an increased memory capacity.
Huawei hopes to deliver raw computing power clusters in the form of SuperPoDs, which are expected to debut starting in the fourth quarter of 2026 with the Atlas 950 SuperPoD, equipped with the new Ascend 950DT chips.
For general computing, Huawei plans to launch two models of Kunpeng 950 processors in the first quarter of 2026, and the “world’s first SuperPoD for general computing,” the TaiShan 950 SuperPoD based on Kunpeng 950, will be available in the first quarter of 2026.
These developments are expected to have significant impacts on businesses in the Arab region, as the new chips may provide opportunities to enhance performance and efficiency across a variety of industries, including artificial intelligence and big data analytics.
Meta Description: Huawei announces new Ascend chips designed for high-performance computing clusters, set to revolutionize industries with open-source AI models and significant advancements in processing capabilities.Keywords: Huawei, Ascend chips, AI, open source, Kunpeng processors, SuperPoD, computing clusters, artificial intelligence, big data analytics “`